Microelectronics Cleanroom Design
04 May 2021

Microelectronics Cleanroom Design

Due to the sensitive nature of their products, clean room facilities for microelectronic and semiconductor applications require stringent environmental controls. These clean rooms also house extremely precise and expensive equipment such as photolithography, etching, cleaning, doping, and dicing machines. Hence, any deficiencies in the cleanliness specifications can affect the entire production process. Other common issues in microelectronic & semiconductor clean room conception and design are the maximizing of space while also enabling future reconfiguration. For all these reasons, a modular clean room system is often the optimal solution.

The fab’s clean room is one of its most important spaces since this is where the environment must be controlled to eliminate all dust, dampened against vibration, kept within narrow bands of temperature and humidity. Microelectronic & semiconductor cleanrooms range from Class 100 to Class 100 000 depending on the processes taking place within the facility.

Our cleanrooms comply with your requirements for the following:

  • airtightness
  • UV filtered light
  • non-retention of particles

Non-proliferation of contaminating agents

For some applications, the cleanroom must also comply with specifications associated with electrostatic charges or discharges (ESD compatibility). Electrostatics can cause product contamination, product damage from electrostatic discharge (ESD) and production equipment malfunction caused by ESD-generated electromagnetic interference (EMI). Our galvanized steel panels are ESD compliant. Controlling temperature and humidity is critical to minimize static electricity. Our cleanrooms can use high precision humidity (up to ±2%) and temperature (up to ±0.25°C) control systems.