Desiccator storage has become critical in more and more manufacturing operations. A look at the costly effects of moisture exposure explains why. As critical components become smaller and more sophisticated, their susceptibility to moisture damage increases. Once absorbed by sensitive components, water creates a number of potentially disastrous conditions. Even minute traces of oxidation, the most notorious result of moisture exposure, can degrade soldering and other manufacturing processes.
In a large, multi-chamber enclosure with a single exit bleed valve, it might take 30 min or more to remove this moisture and recover the relative humidity setpoint. If another door is opened during this time, this recovery time will be extended. In fact, during periods of frequent parts access, the desiccator may never attain the humidity setpoint, and parts could be seriously threatened.
One common method of dealing with moisture contamination is to remove it before each manufacturing step. In the semiconductor industry, vacuum processing and bake-and-bag methods of IC drying accomplish this, but these operations slow down production, particularly if they must be repeated several times in the course of circuit manufacturing. Further, these baking and sealing processes themselves expose parts to thermal extremes that can cause damage.
Low-humidity storage of sensitive samples and supplies can now be done in a pass-through chamber. Desiccators in plastic or stainless steel to comply with ISO cleanliness requirements.
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